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Electronics Cooling® 

Spring 2018 Issue

Now Available!

Download the FREE Electronics Cooling® Spring 2018 Issue Now!

The Latest Issue is now available! To receive your FREE digital copy of the Electronics Cooling® Spring 2018 Issue, simply fill out the form.

Featured in this edition:

  • Use of the Monte Carlo Method in Packaging Thermal Calculations, Bruce Guenin
  • The Junction-to-Case Thermal Resistance: A One-Dimensional Underachiever in a Three-Dimensional, Conjugate Heat Transfer World, Bruce Guenin
  • Developing a Theta: Standard Under Steady-State Testing Conditions, Jesse Galloway & Eduardo de los Heros
  • Beat the Heat in 3D Chip Stacks with Embedded Cooling, Pritish R. Parida, Mark Schultz & Timothy Chainer
  • Strategies for Using Thermal Calculation Methods, IrJim Petroski & Cathy Biber
  • And more!
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