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Electronics Cooling^®

Spring 2018 Issue

Now Available!

Download the FREE Electronics Cooling^® Spring 2018 Issue Now!

The Latest Issue is now available! To receive your FREE digital copy of the Electronics Cooling^® Spring 2018 Issue, simply fill out the form.

Featured in this edition:

Use of the Monte Carlo Method in Packaging Thermal Calculations, Bruce Guenin
The Junction-to-Case Thermal Resistance: A One-Dimensional Underachiever in a Three-Dimensional, Conjugate Heat Transfer World, Bruce Guenin
Developing a Theta: Standard Under Steady-State Testing Conditions, Jesse Galloway & Eduardo de los Heros
Beat the Heat in 3D Chip Stacks with Embedded Cooling, Pritish R. Parida, Mark Schultz & Timothy Chainer
Strategies for Using Thermal Calculation Methods, IrJim Petroski & Cathy Biber
And more!